HTC diamond grinding pad

Description

<br />Resin Bond Diamond Pads for change from President Lopez HTC grinding<br /><br />5-point type<br /><br />Specially designed for concrete floor restoration professional, pillows HTC diamond resin bond grinding is used many times after using metal bond diamond tools for polishing the floor. However, it can in some cases the tool can be used as a diamond resin bond to be launched on a flat smooth floors.<br /><br />Segment elevation: 10MM<br />Part Number: 5<br />No. grit: 50 , 100 .200 .400 , 800 .1500 .3000 <br />Base specification: Standard of the President of HTC grinding

Shipping Type

Free Shipping

  • Shipping Type: EMS
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Charged Shipping

  • Shipping Type: EMS
  • Estimated Delivery Time: 5-8 Days

Price List

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